Filter

×
Active Filters Clear All
Keyword: 服务器 ×
80 Total Reports
1/4 Page
Fortinet Other 2026-07-12

FortiGate Firewalls Breached: 430K Devices Targeted with VPN Credential Sniffing

Attackers compromised approximately 430,000 FortiGate firewalls worldwide, deploying custom sniffers to intercept VPN credentials. The operation is linked to INC Ransom and Lynx ransomware groups, highlighting a new attack surface on edge devices that bypasses traditional EDR/SIEM.

CrowdStrike Other 2026-07-08

CrowdStrike Capitalizes on 5x AIDR Growth to Enter Identity Security, Seizing AI Runtime Control Plane

CrowdStrike reports 5x growth in its AIDR product, expanding into identity security. AIDR monitors AI app data flows, detects prompt injection and model jailbreaks, and launches Shadow AI Discovery for Endpoint to auto-discover AI apps and LLM runtimes on endpoints. This signals a control plane shift from traditional endpoint detection to converged AI workload and identity security.

TSMC Other 2026-07-08

TSMC Ramps PIC Capacity to 25K Wafers, CPO Silicon Photonics Poised to Disrupt AI Interconnects

TSMC plans to expand its PIC capacity to 25,000 wafers per month by 2028, with its COUPE platform becoming critical for reducing latency and power in AI systems. Initial capacity is allocated to NVIDIA, Broadcom, and AMD, marking CPO's transition from lab to mass production and accelerating the shift from electrical to optical AI interconnects.

Amazon Other 2026-07-07

AWS Boosts Trainium3 ASIC Shipments, Accelerating Custom AI Chip Ecosystem Against NVIDIA

Amazon AWS has notified its supply chain to increase Q3 2026 shipments of Trainium3-based ASIC servers by 20-30%. This reflects growing confidence in its custom AI chips and a strategic push to reduce reliance on NVIDIA GPUs. AWS also partnered with OpenAI to develop a Stateful Runtime Environment on Bedrock.

Amazon Other 2026-07-06

AWS boosts Trainium 3 shipments, accelerating ASIC substitution for NVIDIA GPUs

Supply chain sources indicate Amazon AWS has instructed vendors to increase Trainium 3 shipments for Q3 2026 by 20-30%. This signals strong confidence in its custom ASIC strategy to reduce dependence on NVIDIA GPUs, leveraging superior cost and power efficiency for cloud AI training.

Amazon Other 2026-07-06

AWS Trainium 3 Shipments Surge 20-30%, Shifting AI Compute Control from NVIDIA to Custom Silicon

Supply chain sources indicate AWS has raised Q3 Trainium 3 server shipments by 20-30%, driven by Anthropic. Trainium 2 is sold out, Trainium 3 nearly fully booked, with customers already queuing for Trainium 4 and development of Trainium 5 underway. This signals AWS's aggressive push to own the AI compute stack via custom silicon.

Google Cloud Other 2026-07-06

Google Cloud Launches Blackwell GPU Confidential VM & Open-Source Prompt Encryption SDK, Redefining AI Security

Google Cloud upgrades its confidential computing portfolio with Blackwell GPU-based confidential VMs (Confidential G4 VMs preview), open-source Prompt Encryption SDK, and enhanced Confidential Space featuring Intel Trust Authority and Hopper GPU support, addressing TEE vulnerability CVE-2026-33697 to bolster AI inference and cross-organization training security.

Intel Other 2026-07-04

Critical Relay Attack Found in Attestation TLS Protocol: Both Intel TDX and AMD SEV-SNP Affected

A critical architecture flaw in the attestation TLS protocol, enabling relay attacks, has been discovered affecting both Intel TDX and AMD SEV-SNP platforms. With a CVSS score of 7.5, it surpasses recent high-profile confidential computing vulnerabilities. No official patch is currently available.

Intel Other 2026-07-04

英特尔确认上调部分消费级和服务器CPU价格,数据中心产品涨幅达数百美元

...

Anthropic Other 2026-07-04

Anthropic Unleashes Aggressive Geo-Blocking: Timezone Detection & Steganography to Kill Cross-Border AI Access

Ahead of its IPO, Anthropic enforces the strictest geo-blocking policy using timezone detection, steganographic user tagging, and banning four evasion methods. Alibaba has internally banned Claude Code, pushing local alternatives. This reshapes global AI tool compliance.

Qualcomm Other 2026-07-02

Qualcomm Enters AI Inference with Dragonfly C1000 CPU and HBC Near-Memory Compute

Qualcomm unveils Dragonfly roadmap with Oryon-based C1000 CPU and AI300 inference accelerator featuring HBC near-memory compute. Meta and Microsoft are early adopters. The strategy targets AI inference TCO reduction and memory wall breakthrough, bypassing Nvidia's training dominance.

Anthropic Other 2026-07-01

Anthropic Claude Code Covertly Tags Chinese Users: AI Toolchain Trust Fractures

Anthropic embedded covert detection code in Claude Code since April 2026 to identify Chinese users via timezone and domain list, silently tagging them for 3 months. The exposure raises serious concerns about AI toolchain supply chain security and geopolitical weaponization.

TSMC Other 2026-07-01

Etched Unveils Sohu Transformer ASIC: Claims 20x H100 Inference Throughput, Challenging NVIDIA's Grip

AI chip startup Etched emerges from stealth with Sohu, a Transformer-specific ASIC on TSMC N4P with 144GB HBM3E. By hardwiring attention mechanisms, it claims 20x throughput and 140x price-performance vs. H100 on Llama 70B. With $800M total funding and first racks shipping this summer, it directly challenges NVIDIA's inference dominance.

Research Other 2026-06-30

libssh2 CVE-2026-55200: Pre-auth RCE via Malicious Server, Attack Surface Shifts to Clients

A critical heap out-of-bounds write vulnerability (CVE-2026-55200, CVSS 9.2) in libssh2 allows a malicious SSH server to achieve pre-auth RCE on connecting clients. The flaw affects curl, Git, PHP, and many other projects statically linking the library, expanding the attack surface from servers to virtually any client application, including CI/CD, backup, and embedded systems.

TSMC Other 2026-06-29

TSMC Adds Winbond to WoW 3D Stacking Memory Supply, Breaking DRAM Oligopoly

Winbond joins TSMC's Wafer-on-Wafer (WoW) 3D stacking advanced packaging supply chain, becoming a new DRAM wafer supplier alongside Samsung, SK Hynix, and Micron. This move reduces reliance on the three global DRAM giants and strengthens AI chip packaging supply resilience. Winbond provides DRAM wafers for vertical stacking with TSMC logic wafers, offering 8GB capacity and 256GB/s bandwidth via its CUBE solution.

Samsung Electronics Other 2026-06-29

Samsung and SK Hynix Announce $300B Investment to Dominate AI Memory and Foundry

Samsung and SK Hynix announce a 10-year, 1,000 trillion won investment plan to expand HBM4 production, improve 3nm GAA yield, and build new AI chip fabs. This aims to cement their HBM duopoly and close the gap with TSMC in advanced foundry, reshaping global AI infrastructure supply chain costs.

NVIDIA Other 2026-06-26

NVIDIA Rubin Mandates 100% Liquid Cooling with 45°C Warm Water, Reshaping Data Center Thermal Design

NVIDIA reveals Rubin platform's full liquid cooling design: 100% liquid, 45°C warm water inlet, eliminating chillers and fans. Mass production starts H2 2026, with a mandate for all data centers to transition to liquid cooling, marking a definitive shift in AI thermal management.

NVIDIA Other 2026-06-25

NVIDIA Unveils Vera CPU for AI Agents, Shifting Control from x86 to Proprietary Silicon

At the annual meeting, Huang announced Vera CPU for AI agents paired with Rubin GPU, claimed Blackwell delivers 30x token throughput over next-best platform, and reiterated CUDA as a moat. This move aims to shift AI compute control from general-purpose CPUs to NVIDIA's proprietary architecture.

ARM Other 2026-06-23

Arm Server Share Hits 45%: NVIDIA's Bundling Strategy Reshapes AI Infrastructure

IDC data shows Arm-based servers now hold over 45% of the global server market, driven by NVIDIA's bundling of its Arm-based Vera CPU with GPU systems like NVL72 and Rubin. x86 share shrinks to 52%, while accelerated systems contribute over 70% of revenue. ODM direct sales account for 50.2%, with Dell revenue growing 244.1% YoY.

Intel Other 2026-06-23

Intel at Computex 2026: CPU as Agentic AI Orchestrator, x86 Reclaims Inference Control

At Computex 2026, Intel unveiled the 288-core Xeon 6+ (Intel 18A) and 3rd-gen Core Ultra, claiming Agentic AI shifts CPU:GPU ratio from 1:8 to 1:1. Partnering with SambaNova and Foxconn for rack-scale inference systems, Intel repositions the CPU as the orchestrator for multi-step AI reasoning, aiming to reclaim control from GPU-centric architectures.