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Intel Other 2026-06-02

Intel and SambaNova Rackscale AI: CPU Regains Inference Control Plane

At Computex 2026, Intel unveiled rack-scale AI infrastructure combining Xeon 6+ with SambaNova SN-50 RDUs, plus a fully disaggregated inference cloud (prefill on NVIDIA Blackwell, decode on RDUs) by Vector Core Compute. This aims to reposition the CPU as the central orchestrator for inference, challenging GPU dominance.

Intel Other 2026-06-01

Intel Reclaims AI Control Plane: Xeon 6+ and E835 Target Agentic Orchestration

Intel launches Xeon 6+ (288 E-cores on 18A), E835 200GbE controllers, and Crescent Island GPU. The strategy repositions the CPU as the control plane for agentic AI orchestration and data movement, while using E835 Ethernet to standardize AI data center networking.

Cisco Other 2026-05-28

Cisco Scale-Across: Converged Silicon and Optics for Distributed AI Training

Cisco unveils Scale-Across architecture combining Silicon One P200 routing (51.2Tbps) and coherent pluggables (400G/800G ZR/ZR+) with open line systems, enabling deterministic low-latency, lossless connectivity for distributed AI training across data centers separated by tens of kilometers.

Cisco Other 2026-05-20

Cisco G300 Intelligent Packet Flow: Hardware-Accelerated AI Networking Breakthrough

Cisco launches Intelligent Packet Flow on Silicon One G300, transforming the fabric into an intelligent system with hardware-accelerated adaptive routing, collective congestion awareness, and telemetry. In 8K-16K GPU clusters, it reduces CCT by 87% vs ECMP, improves JCT by 82%, and unlocks 28% more GPU efficiency.

AMD Other 2026-05-20

AMD Ryzen AI Halo & Max PRO 400: Local 300B Parameter Inference, but Hidden Lock-in and Thermal Limits

AMD launches Ryzen AI Halo developer platform (128GB unified memory, 200B parameter models) and Ryzen AI Max PRO 400 series (first x86 client to run 300B parameter models locally). Unified memory, ROCm optimization, and OEM partnerships aim to shift agentic AI from cloud to local, but shared memory bandwidth and thermal constraints limit real-world throughput.

AMD Other Medium Signal 2026-05-07

AMD Backs SPEC CPU 2026 Benchmark, Emphasizing Open, Trusted Performance Measurement

AMD published a blog endorsing the upcoming SPEC CPU 2026 industry benchmark, emphasizing the critical role of open, reproducible CPU performance standards for customer infrastructure decisions in the AI era. The new benchmark updates its application suite and strengthens support for bare-metal cloud environments and parallel computing.

AMD Other High Signal 2026-05-06

AMD and OpenAI Contribute MRC Protocol to OCP for Scalable AI Networking

AMD, in collaboration with OpenAI, Microsoft, and others, contributed the MRC (Multipath Reliable Connection) protocol, designed for large-scale AI training, to the Open Compute Project (OCP). AMD co-authored the specification and has already deployed MRC on its programmable Pensando DPU/NIC products, positioning its networking technology as a key enabler for resilient and adaptive AI infrastructure.

AMD Other High Signal 2026-05-06

AMD and OpenAI Introduce MRC, a Next-Gen Transport Protocol for AI Training

AMD, in collaboration with OpenAI, Microsoft, and other industry leaders, has released the specification for the Multipath Reliable Connection (MRC) protocol. MRC addresses performance bottlenecks of RoCEv2 in hyperscale AI training clusters through intelligent packet spraying, selective retransmission, and network-signaled congestion control, aiming to improve bandwidth utilization and job resilience.

AMD Other Medium Signal 2026-05-04

AMD Showcases Heterogeneous Computing Strategy for Enterprise AI with Dell

At Dell Technologies World, AMD highlighted its heterogeneous computing portfolio, aiming to match the right compute engine to specific enterprise AI workloads, while emphasizing hardware-based security and manageability. This signals a shift in AI infrastructure from generic solutions to fine-tuned, scenario-specific deployments.

Google Other High Signal 2026-05-04

Google Launches Enterprise AI Agent Platform and 8th-Gen TPUs, Betting on the 'Agentic Era'

At Cloud Next '26, Google introduced the Gemini Enterprise Agent Platform for building and governing autonomous AI agent workflows, alongside 8th-generation TPUs specifically designed for agentic AI. The company also released the Gemma 4 open model and Deep Research Max for advanced data analysis.

AMD Other High Signal 2026-04-30

AMD Proposes New AI Infrastructure Networking Paradigm: From Lossless Fabrics to Intelligent Endpoints

AMD published a blog outlining seven key questions for building large-scale AI infrastructure, arguing that traditional lossless Ethernet or InfiniBand architectures face cost and complexity bottlenecks. It advocates shifting network intelligence and reliability functions from expensive, specialized switches to intelligent NICs, enabling reliable transport over standard (potentially lossy) Ethernet to reduce TCO and simplify operations.

AMD Other High Signal 2026-04-29

AMD and Liquid AI Discuss Efficient AI Architecture from Silicon to Systems

AMD's CTO and Liquid AI's CEO discuss the evolution of AI architecture, emphasizing efficiency as key to extending AI from the cloud to edge and endpoint devices. They argue that co-design from silicon to systems enables low-power, responsive AI inference, supporting always-on agents and multi-model orchestration.

Google Other 2026-04-29

Google Opens TPU Hardware to On-Prem, 8th-Gen Chips Target Nvidia

Google announces 8th-gen TPUs (8t for training with 3x performance over Ironwood, 8i for inference with 80% better perf/dollar) and plans to deliver TPU hardware directly to customer data centers. Also closed Wiz acquisition to bolster AI security. This marks a strategic pivot from cloud-only to hardware supplier.

AMD Other High Signal 2026-04-27

AMD Extends Edge AI Architecture to Space, Defining Orbital Computing Paradigm

AMD's CTO proposes applying the core principles of 'performance-per-watt' and 'mission-critical reliability' from terrestrial edge AI to space computing. The company is providing a repeatable platform foundation for in-orbit satellite intelligence and future orbital data centers through heterogeneous computing, open software stacks, and modular system design.

AMD Other High Signal 2026-04-27

AMD Highlights AI PC as Critical Infrastructure for Enterprise Agentic AI in IDC White Paper

AMD released an IDC white paper indicating that over 80% of enterprises are planning, piloting, or deploying AI PCs to support scaled Agentic AI. The report highlights high-performance NPUs and on-device AI processing as critical for enabling real-time, secure workflows, signaling a shift in enterprise AI infrastructure from cloud to endpoint.

Nokia Other High Signal 2026-04-09

Nokia Launches Application-Optimized Optical Solution Suite for AI-Era Networks

Nokia announced a suite of new coherent optical transport solutions and a compact multi-fiber amplifier, employing a building-block design methodology to optimize performance, power, and cost for diverse AI application scenarios like DCI and campus networks.

Cisco Other High Signal 2026-04-07

Cisco and Intel Launch Unified Edge Platform for Real-Time Media

Cisco introduces Unified Edge powered by Intel Xeon 6 SoC, delivering edge AI processing for sports and media industries. The solution converges networking, security, and compute to enable real-time fan experiences and remote production.

AMD Other High Signal 2026-04-02

AMD Announces Breakthrough MLPerf Inference 6.0 Results, Showcasing Multinode Scaling and Multimodal Capabilities

AMD's MLPerf Inference 6.0 submission, powered by Instinct MI355X GPUs, surpassed 1 million tokens per second for the first time on models like Llama 2 70B and GPT-OSS-120B. The results highlight efficient multinode scaling, rapid enablement of new workloads (e.g., text-to-video model Wan-2.2-t2v), and reproducible performance across a broad partner ecosystem.

Qualcomm Other High Signal 2026-03-31

Qualcomm Launches NPU-Integrated Wearable Platform to Advance On-Device AI and Personal AI Ecosystem

Qualcomm unveiled the Snapdragon Wear Elite platform, its first wearable platform with an integrated NPU designed for on-device AI, capable of supporting up to two-billion-parameter models. It marks a strategic shift from smartphone-centric to agent-centric computing, leveraging wearables for continuous context and enabling intelligence to flow across a user's device ecosystem.

ARM Other High Signal 2026-03-25

Arm Neoverse Reshapes Control Layer in AI Infrastructure

ARM introduces Neoverse infrastructure CPU cores optimized for cloud, AI, and HPC workloads, adopted by NVIDIA, AWS, Microsoft, and Google for their AI platforms, delivering performance gains and energy efficiency. This architecture enables high-density AI workload deployment in cloud and edge environments with enhanced multi-tenant security.