Reports
AI-generated structured vendor updates
AMD and NAVER Cloud Collaborate on Sovereign AI Infrastructure in Korea
AMD and NAVER Cloud announced a strategic collaboration to accelerate sovereign AI infrastructure in Korea. NAVER Cloud will expand deployment of AMD EPYC "Venice" CPUs and gain early access to next-gen Instinct MI455X GPUs, with joint optimization of AI services and software stacks on AMD platforms.
AMD and Samsung Deepen Collaboration, Locking HBM4 Supply and Exploring Foundry Partnership
AMD and Samsung signed an MOU, designating Samsung as the primary HBM4 supplier for the next-gen Instinct MI455X GPU and collaborating on DDR5 memory optimized for 6th Gen EPYC CPUs. The companies will also explore opportunities for Samsung to provide foundry services for future AMD products.
TSMC Launches Advanced Packaging Platform for Heterogeneous Integration
TSMC launches an advanced packaging platform integrating CoWoS, InFO, and SoIC 3D stacking technologies for micron-level vertical integration of chips across process nodes. It delivers higher interconnect density, bandwidth, and lower power consumption, supporting complex SoC designs as part of its Open Innovation Platform to accelerate time-to-market.
Cisco Launches G300 Chip and Systems for AI Agent-Era Data Center Networking
Cisco introduces 102.4Tbps Silicon One G300 switching chip with liquid-cooled N9000/8000 systems delivering 70% energy efficiency, 1.6T optics support, and Nexus One unified management plane upgrade.
ASML showcases holistic lithography solutions at SEMICON India, betting on India's chipmaking growth
At SEMICON India 2025, ASML showcased its lithography portfolio, including TWINSCAN NXE and EXE EUV systems for advanced logic and memory chip production. This move aims to support India's nascent semiconductor manufacturing ecosystem in response to government incentives.
Bosch and Qualcomm Deepen Collaboration to Consolidate ADAS and Cockpit Compute on Single SoC
Bosch and Qualcomm are expanding their strategic partnership to jointly develop production-ready ADAS solutions based on the Snapdragon Ride platform, and to consolidate cockpit and ADAS functions onto a single SoC using Snapdragon Ride Flex. This aims to provide automakers with a clear migration path from distributed to centralized compute architectures, reducing system complexity and cost.
Qualcomm and Snap Deepen Collaboration, Betting on XR Devices as New AI Computing Endpoints
Qualcomm and Snap's subsidiary, Specs Inc., have signed a multi-year strategic agreement to power future Specs smart glasses with Snapdragon XR platforms. The collaboration aims to establish a scalable foundation for developers to create more intelligent and private on-device AI experiences on eyewear. This move signifies an evolution of their long-term partnership from consumer AR glasses towards a platform emphasizing device-side AI agents and immersive computing.
Coherent Expands InP Fab with $50M CHIPS Grant, AI's Connectivity Bottleneck Drives Photonics Arms Race
Coherent receives $50M CHIPS Act grant to expand its 6-inch InP fab in Texas, quadrupling capacity. NVIDIA's $2B strategic investment and CEO Jensen Huang's presence signal a shift from GPU compute scaling to optical interconnect as the new AI infrastructure bottleneck.
NVIDIA Absorbs Groq LPU: Feynman GPU to Integrate SRAM Inference Tile, Hybrid Architecture by 2028
NVIDIA secures Groq's LPU inference technology via a non-exclusive license and key hires, planning to integrate large SRAM tiles into its 2028 Feynman GPU using TSMC SoIC hybrid bonding. This enables deterministic scheduling and 80TB/s on-chip bandwidth, shifting NVIDIA from a pure GPU vendor to a hybrid inference/training platform.