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Google Other 2026-04-09

Google Introduces 'Learn Mode' in Colab, Shifting AI Coding Assistant to Teaching

Google Colab introduces two new features for its integrated Gemini AI assistant: 'Custom Instructions' and 'Learn Mode'. The former allows users to tailor the assistant's behavior by project or syllabus and share these settings, while the latter transforms the AI from a code generator into a step-by-step teaching tutor aimed at building user coding skills.

Google Other Medium Signal 2026-04-08

Google Deeply Integrates NotebookLM into Gemini, Launches Personal Knowledge Base Feature

Google introduces 'notebooks' within its Gemini app, deeply syncing with NotebookLM. This move aims to integrate AI conversations, project files, and personal knowledge bases, evolving the AI assistant from a single-interaction tool into a structured knowledge management platform for long-term, complex projects.

ARM Other 2026-04-07

Arm Partners with Monash University Malaysia to Advance Semiconductor Talent for AI Era

Arm announced a collaboration with Monash University Malaysia's School of Engineering, donating IC design development boards and appointing an executive as a guest lecturer. The initiative aims to cultivate semiconductor talent with hands-on Arm architecture and modern system design experience for the AI era.

Cisco Other High Signal 2026-04-07

Cisco and Intel Launch Unified Edge Platform for Real-Time Media

Cisco introduces Unified Edge powered by Intel Xeon 6 SoC, delivering edge AI processing for sports and media industries. The solution converges networking, security, and compute to enable real-time fan experiences and remote production.

Anthropic Other High Signal 2026-04-06

Anthropic Draws Red Lines for AI Military Use in the Name of National Security

Anthropic publicly states its refusal to remove two key safeguards in its work with the U.S. Department of War: a ban on mass domestic surveillance and fully autonomous weapons systems. The company faces threats of being labeled a supply chain risk or forced removal of safeguards via the Defense Production Act. This move directly ties AI ethics to geopolitical competition.

Anthropic Other High Signal 2026-04-06

Anthropic Locks in Multi-Gigawatt Next-Gen TPU Capacity with Google and Broadcom

Anthropic has signed a new agreement with Google and Broadcom to secure multiple gigawatts of next-generation TPU capacity, expected online starting 2027. This expansion aims to power frontier Claude models and meet surging global customer demand. The partnership significantly expands Anthropic's $50 billion U.S. compute infrastructure commitment.

AMD Other High Signal 2026-04-02

AMD Announces Breakthrough MLPerf Inference 6.0 Results, Showcasing Multinode Scaling and Multimodal Capabilities

AMD's MLPerf Inference 6.0 submission, powered by Instinct MI355X GPUs, surpassed 1 million tokens per second for the first time on models like Llama 2 70B and GPT-OSS-120B. The results highlight efficient multinode scaling, rapid enablement of new workloads (e.g., text-to-video model Wan-2.2-t2v), and reproducible performance across a broad partner ecosystem.

Google Other 2026-04-02

Google Opens Free Access to Veo Video Generation Model, Democratizing AI Video Creation

Google announced that its AI video creation tool, Vids, now offers high-quality video generation for free, granting all personal accounts 10 free monthly credits using the Veo 3.1 model, alongside a Chrome extension to streamline screen recording workflows.

NVIDIA Other High Signal 2026-03-31

NVIDIA Collaborates with Energy Leaders to Position AI Factories as Smart Grid Assets

NVIDIA, in collaboration with Emerald AI, proposes treating large-scale AI data centers (AI factories) as flexible, intelligent grid assets rather than static power loads. This architecture integrates accelerated computing, power networking, and control to enhance grid reliability and optimize energy efficiency. Several major energy companies plan to collaborate on this architecture to support AI workloads and accelerate power connection.

NVIDIA Other High Signal 2026-03-31

NVIDIA Collaborates with Energy Leaders on AI Factory-Grid Integration Architecture

NVIDIA and Emerald AI introduced a new architecture treating AI factories as intelligent grid assets, combining accelerated computing, real-time energy orchestration and reference designs. The Vera Rubin DSX-based approach enables dynamic grid response and has gained support from multiple energy providers.

ARM Other 2026-03-31

Arm Partners with Malaysian University to Cultivate Semiconductor Talent for AI Era

Arm announced a collaboration with Monash University Malaysia's School of Engineering, donating IC design development boards and establishing a guest lecturer program. The initiative aims to provide students with hands-on experience in AI chip design based on Arm architecture, addressing the growing demand for advanced computing talent in the APAC region.

ARM Other High Signal 2026-03-27

Arm Expands into Silicon Products with First Self-Designed AGI CPU

Arm is expanding its compute platform into production silicon for the first time, launching the self-designed Arm AGI CPU for AI data centers and agentic workloads. It targets over 2x performance per rack versus x86 platforms and is backed by lead partner Meta, customers like OpenAI, and a broad OEM/ODM ecosystem.

Apple Other High Signal 2026-03-26

Apple Expands American Manufacturing Program, Bolstering Domestic AI and Sensor Supply Chains

Apple announced new partners for its American Manufacturing Program, including Bosch, Cirrus Logic, TDK, and Qnity Electronics, to shift production of critical sensors, semiconductor materials, and AI-related components to the U.S. The move involves a $400 million investment and collaborations with TSMC and GlobalFoundries to establish advanced domestic process capabilities.

NVIDIA Other High Signal 2026-03-25

NVIDIA Demonstrates AI Factories as Flexible Grid Assets for Peak Demand Management

NVIDIA, in collaboration with EPRI, National Grid, and Emerald AI, demonstrated how AI factories powered by Blackwell GPU clusters can dynamically adjust power consumption in response to grid signals. This allows them to act as 'shock absorbers' during peak demand while maintaining performance for high-priority AI workloads.

ARM Other 2026-03-25

ARM Builds Its First Chip in 35 Years: AGI CPU Targets AI Data Centers, Meta First Customer

ARM announces its first in-house CPU in 35 years, the AGI CPU, targeting AI and data center workloads. Meta is the launch customer. Built on TSMC's 3nm process, the chip focuses on performance-per-watt, directly challenging x86 dominance and fundamentally restructuring ARM's business model from IP licensor to merchant silicon vendor.

ARM Other High Signal 2026-03-25

ARM Launches AGI CPU for Agentic AI Infrastructure Era

ARM introduces the Arm AGI CPU, its first silicon product, designed for agentic AI infrastructure on Neoverse. Optimized for massively parallel workloads, it supports 272 cores per blade in a 1OU design, delivering 8160 cores per rack and over 2x performance vs. x86 systems.

ARM Other High Signal 2026-03-25

ARM Launches AGI CPU Silicon for AI Infrastructure Market

ARM introduced its first production AGI CPU silicon in March 2026, marking a strategic shift from IP licensing to full silicon solutions provider. Designed for next-gen AI infrastructure, this move may reshape the data center processor ecosystem.

ARM Other High Signal 2026-03-25

Arm Neoverse Reshapes Control Layer in AI Infrastructure

ARM introduces Neoverse infrastructure CPU cores optimized for cloud, AI, and HPC workloads, adopted by NVIDIA, AWS, Microsoft, and Google for their AI platforms, delivering performance gains and energy efficiency. This architecture enables high-density AI workload deployment in cloud and edge environments with enhanced multi-tenant security.

ARM Other High Signal 2026-03-24

ARM and NVIDIA Drive Localization Revolution in AI Workstations

ARM and NVIDIA jointly launch DGX Spark AI workstations based on GB10 Grace Blackwell chips, with eight major OEMs releasing products simultaneously. The solution features unified memory architecture supporting 200B parameter models locally, with third-party tests showing 41% faster rendering and 3.2x AI processing speed versus x86 alternatives, enabling seamless cloud-to-edge toolchain migration.

Samsung Electronics Other 2026-03-20

SK Hynix Jumps to TSMC 3nm for HBM4E Logic Die to Counter Samsung's 4nm Lead

SK Hynix plans to use TSMC's 3nm process for the logic die in its 7th-gen HBM4E, a leap from the 12nm used in HBM4. This aims to reverse the performance gap with Samsung (which used 4nm logic in HBM4) and deliver higher bandwidth and power efficiency for next-gen AI chips like NVIDIA's Vera Rubin Ultra.