Reports
AI-generated structured vendor updates
Samsung Unveils HBM4E and Hybrid Copper Bonding for AI Infrastructure
Samsung announced HBM4 mass production and showcased next-gen HBM4E with 4TB/s bandwidth at GTC 2026. Hybrid copper bonding enables 16+ layers with 20% lower thermal resistance. Also launched SOCAMM2 memory and PCIe 6.0 SSD for NVIDIA AI infrastructure.
NVIDIA and SK hynix Co-Architect Next-Gen Memory for AI Factories, Locking HBM4 to Vera Rubin
NVIDIA and SK hynix announce a multi-year tech partnership to co-develop next-gen memory for Vera Rubin, RTX Spark, and Jetson Thor. Separately, SK Telecom deploys a gigawatt-scale AI cloud using the full DGX stack, targeting 2027. This elevates SK hynix from supplier to co-architect, strengthening NVIDIA's lock-in on HBM and the AI ecosystem.
SK Hynix HBM4E Samples: 3nm Logic, 384GB/GPU, Igniting AI Memory Bandwidth Arms Race
SK Hynix has sampled its 12-layer HBM4E, featuring TSMC 3nm logic die and enhanced per-pin bandwidth, targeting Nvidia Rubin Ultra with 384GB per GPU. This marks the start of a sprint with Samsung in next-gen AI memory, where HBM BOM share has surged to 65-70%.