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AMD Other High Signal 2026-03-18

AMD and NAVER Cloud Collaborate on Sovereign AI Infrastructure in Korea

AMD and NAVER Cloud announced a strategic collaboration to accelerate sovereign AI infrastructure in Korea. NAVER Cloud will expand deployment of AMD EPYC "Venice" CPUs and gain early access to next-gen Instinct MI455X GPUs, with joint optimization of AI services and software stacks on AMD platforms.

AMD Other High Signal 2026-03-18

AMD and Samsung Deepen Collaboration, Locking HBM4 Supply and Exploring Foundry Partnership

AMD and Samsung signed an MOU, designating Samsung as the primary HBM4 supplier for the next-gen Instinct MI455X GPU and collaborating on DDR5 memory optimized for 6th Gen EPYC CPUs. The companies will also explore opportunities for Samsung to provide foundry services for future AMD products.

Samsung Electronics Other Medium Signal 2026-03-18

Samsung and AMD Deepen AI Hardware Collaboration with HBM4 Supply and Foundry Services

Samsung will be the primary HBM4 supplier for AMD's next-gen MI455X GPU, delivering 13Gbps bandwidth memory. The partners will also develop DDR5 solutions for 6th-gen EPYC CPUs and explore Samsung's foundry services for future AMD products.

Intel Other Medium Signal 2026-03-17

Intel Xeon 6 Selected as Host CPU for NVIDIA DGX Rubin, Enhancing AI Inference Infrastructure

Intel Xeon 6 is chosen as host CPU for NVIDIA DGX Rubin NVL8 AI system, delivering 3x memory bandwidth and full-path confidential computing. This collaboration highlights CPU's architectural role in data orchestration and security for AI inference workloads.

Qualcomm Other High Signal 2026-03-13

Qualcomm Launches AI-Native Wi-Fi 8 Portfolio with Dedicated AI Accelerators

Qualcomm launches AI-native Wi-Fi 8 portfolio including FastConnect 8200 client chip and Networking Pro 1630 networking platform. Both integrate dedicated AI accelerators, support MLO multi-link operation and 320MHz channel bandwidth, enabling real-time network optimization and low-power AI processing. This signifies wireless connectivity evolution from general transmission to AI-driven感知 network architecture.

NVIDIA Other 2026-03-13

NVIDIA Warp: Differentiable Physics Simulation for AI Training on GPU

NVIDIA Warp is a framework for GPU-accelerated, differentiable physics simulation. It enables writing high-performance kernels in Python, with automatic differentiation, and integrates with PyTorch/JAX. The 2D Navier-Stokes example demonstrates end-to-end optimization, reducing the cost of generating training data for physics AI.

Intel Other Medium Signal 2026-03-12

Intel Launches P-Core Processors for Edge Deterministic Computing

Intel releases Core Series 2 processors codenamed Bartlett Lake with P-core architecture for industrial edge applications. The processors deliver deterministic performance and precise timing for concurrent workload processing. This complements the Core Ultra Series 3 and edge AI suite for a complete platform solution.

Apple Other Medium Signal 2026-03-11

Apple Launches M5 Chip Family with Enhanced AI Performance and Storage

Apple introduces M5 series chips with 4x AI performance boost, MacBook Pro standard storage increased to 1TB-2TB, and Wi-Fi 7 support. Launches entry-level MacBook Neo with fanless design and custom chips, expanding low-price market.

Nokia Other Medium Signal 2026-03-07

Broadcom Launches VMware Telco Cloud Platform 9, Enhancing Hardware Efficiency and Sovereign Readiness

Broadcom releases VMware Telco Cloud Platform 9, optimizing virtualization and resource scheduling to improve CPU/memory utilization and reduce TCO. It enhances data localization, security isolation, and compliance controls for global sovereignty regulations. The platform integrates NFV and CNF orchestration for core to edge telecom workloads.

Apple Other Medium Signal 2026-03-03

Apple Introduces M5 Chip with Enhanced AI Compute Capabilities

Apple launches new MacBook Air with in-house M5 chip, claiming world's fastest CPU cores and 4x AI processing boost over M4. Features neural accelerators, Wi-Fi 7 support, and doubled base storage to 512GB.

Apple Other Medium Signal 2026-03-03

Apple M5 Chips Integrate Neural Accelerators for Enhanced Local AI Inference

Apple launches M5 Pro and M5 Max chips with Fusion architecture integrating dual-die SoC, featuring neural accelerators per GPU core for 4x AI performance boost. Unified memory bandwidth up to 614GB/s supports 128GB RAM, optimized for local LLM processing and AI model training.

Apple Other Medium Signal 2026-03-03

Apple Introduces M5 Pro/Max Chips with Fusion Architecture for Enhanced AI Performance

Apple launches M5 Pro and M5 Max chips featuring a new fusion architecture that packages two 3nm dies into a single SoC, delivering over 4x AI performance improvement. The chips include an 18-core CPU and GPU with integrated neural accelerators, with unified memory bandwidth up to 614GB/s.

Intel Other Medium Signal 2026-03-03

Intel Demonstrates Xeon 6 Unified Platform for AI-Ready Network Architecture

Intel demonstrated a unified compute platform based on Xeon 6 processors at MWC 2026, enabling Cloud RAN, AI inference and media processing on the same CPU. This architecture eliminates need for specialized hardware, providing smooth transition from 5G to AI-native 6G.

Trend Micro Other High Signal 2026-03-03

Trend Micro Report Highlights AI Supply Chain Risks and Model Attack Surfaces

Trend Micro's 'Fault Lines in the AI Ecosystem' report systematically analyzes security risks in the AI supply chain, including training data poisoning, third-party plugin vulnerabilities, and model theft attacks. It indicates that enterprise AI security boundaries have expanded from traditional IT infrastructure to the model layer and data pipelines.

Apple Other 2026-03-02

Apple Launches iPhone 17e: Doubles Performance with In-House C1X Modem, Holds $599 Starting Price

Apple launched the iPhone 17e, featuring its in-house C1X cellular modem, which doubles the speed and improves energy efficiency by 30% compared to its predecessor. The model also includes the A19 chip and doubles the base storage to 256GB while maintaining the same starting price, aiming to strengthen its competitiveness in the premium entry-level segment.

Apple Other Medium Signal 2026-03-02

Apple Integrates M4 Chip into iPad Air for Enhanced On-Device AI and Wireless Capabilities

Apple incorporates M4 chip into iPad Air, boosting on-device AI compute and graphics performance. Integrates proprietary N1 Wi-Fi and C1X cellular modem for vertical wireless technology control. Hardware enhancements support higher memory bandwidth and energy efficiency for local AI tasks.

Samsung Electronics Other Medium Signal 2026-03-02

Samsung and AMD Deepen Collaboration for AI-Network Commercial Deployment

Samsung and AMD advance their collaboration on 5G core and vRAN to commercial phase, using AMD EPYC 9005 CPUs for AI-driven network solutions. Technical validation shows AI vRAN achieves commercial-grade performance on software-only stacks, reducing hardware dependency. Partnership extends to edge AI, including video analytics and ISAC sensing.

AMD Other Medium Signal 2026-03-01

AMD Launches Gaming PC Certification Framework to Strengthen Platform Strategy

AMD introduces Advantage Gaming Desktops certification program, requiring OEMs to adopt AMD's 3A platform combining processors, GPUs and software technologies. The program sets hardware performance standards including Ryzen 7/9 processors and Radeon RX 7000 GPUs, with integrated software optimization.

AMD Other Medium Signal 2026-03-01

AMD Launches Advantage Premium Framework for Premium Gaming Laptops

AMD introduces Advantage Premium framework, setting strict design standards and certification for premium gaming laptops. Requires 3A combination of Ryzen AI 300 series processors and Radeon RX 7000M GPUs with dedicated AI engines, OLED displays, and Wi-Fi 7 connectivity. Achieves performance and efficiency through system-level optimization of CPU, GPU, and software stack.

Samsung Electronics Other High Signal 2026-03-01

Samsung and NVIDIA Complete Multi-Cell AI-RAN Test with Chip-Level Integration

Samsung validated integrated vRAN software with NVIDIA's accelerated computing platform in real network environments, demonstrating AI algorithm optimization for wireless physical layer performance. The collaboration extends to chip-level architecture using unified processors to optimize CPU-GPU connectivity for spectrum efficiency.