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AMD Other Medium Signal 2026-03-04

AMD Launches Vitis Embedded Platform for Edge AI Development

AMD introduces Vitis Embedded Platform offering pre-built hardware/software foundations for adaptive SoCs and FPGAs, integrating OS, drivers and middleware to streamline edge AI development. Provides out-of-box support for Kria and Zynq evaluation kits, accelerating deployment in robotics and industrial vision applications.

AMD Other Medium Signal 2026-03-04

AMD Refocuses Vitis Acceleration Strategy on IP Library and Platform Support

AMD's Vitis Acceleration Library 2025.2 introduces a cross-domain IP library for enhanced hardware acceleration usability, while discontinuing support for some PL libraries and older platforms. This refocuses on performance optimization and resource efficiency, urging developers to adopt new IP libraries.

Amazon Other High Signal 2026-03-04

NTT DOCOMO and AWS Enable AI-Automated 5G Core Hybrid Cloud Deployment

NTT DOCOMO partnered with AWS and NEC to deploy a commercial 5G core hybrid cloud in APAC, using AI agent systems based on Amazon Bedrock AgentCore. Automation via Model Context Protocol and GitOps reduced deployment time by 80%, while an operational AI system cut incident response time by 50% through real-time analysis of million-scale device data.

Amazon Other Medium Signal 2026-03-04

AT&T and AWS Launch Last-Mile Interconnect for AI Workloads

AT&T and AWS collaborate on AWS Interconnect – last mile preview, extending AT&T's 5G and fiber networks directly to AWS cloud for end-to-end secure architecture. Designed for low-latency, data-intensive AI workloads like real-time analytics and machine learning. Customers can configure last-mile connections directly in AWS environment, with availability planned for Q2 2026 in select regions.

Apple Other Medium Signal 2026-03-03

Apple Introduces M5 Chip with Enhanced AI Compute Capabilities

Apple launches new MacBook Air with in-house M5 chip, claiming world's fastest CPU cores and 4x AI processing boost over M4. Features neural accelerators, Wi-Fi 7 support, and doubled base storage to 512GB.

Apple Other Medium Signal 2026-03-03

Apple M5 Chips Integrate Neural Accelerators for Enhanced Local AI Inference

Apple launches M5 Pro and M5 Max chips with Fusion architecture integrating dual-die SoC, featuring neural accelerators per GPU core for 4x AI performance boost. Unified memory bandwidth up to 614GB/s supports 128GB RAM, optimized for local LLM processing and AI model training.

Apple Other Medium Signal 2026-03-03

Apple Introduces M5 Pro/Max Chips with Fusion Architecture for Enhanced AI Performance

Apple launches M5 Pro and M5 Max chips featuring a new fusion architecture that packages two 3nm dies into a single SoC, delivering over 4x AI performance improvement. The chips include an 18-core CPU and GPU with integrated neural accelerators, with unified memory bandwidth up to 614GB/s.

Apple Other Medium Signal 2026-03-03

Apple Launches Thunderbolt 5 Displays to Strengthen Professional Workstation Ecosystem

Apple introduced new Studio Display series with Thunderbolt 5 supporting daisy-chaining of up to four displays, while the flagship XDR model features mini-LED technology with 2000 nits brightness and 120Hz refresh rate for professional creative workflows.

Cisco Other Medium Signal 2026-03-03

Cisco Promotes eBPF Kernel Security Architecture Through VoidLink Analysis

Cisco analyzes the VoidLink malware framework to expose security gaps in cloud-native and AI workloads, highlighting visibility limitations of traditional security solutions. The company demonstrates Hypershield's eBPF-based kernel-level runtime security for container and Kubernetes environments.

Intel Other Medium Signal 2026-03-03

Intel Demonstrates Xeon 6 Unified Platform for AI-Ready Network Architecture

Intel demonstrated a unified compute platform based on Xeon 6 processors at MWC 2026, enabling Cloud RAN, AI inference and media processing on the same CPU. This architecture eliminates need for specialized hardware, providing smooth transition from 5G to AI-native 6G.

Google Other 2026-03-03

Google AI Optimizes CTV Ad Format Dynamic Allocation

Google launched AI-driven VRC Non-Skip ads, using AI to dynamically select between 6s, 15s, and 30s ad formats for optimized CTV delivery. The solution leverages YouTube's streaming dominance but does not involve core infrastructure changes.

Huawei Other Medium Signal 2026-03-03

Huawei Releases 115 Industrial AI Cases to Strengthen Ecosystem

At MWC 2026, Huawei showcased 115 industrial AI benchmark cases and 22 joint solutions developed with global clients, applying 5G, AI, and cloud technologies across manufacturing, energy, and transportation sectors.

Samsung Electronics Other 2026-03-03

Samsung Galaxy S25 Series Launches Globally, Edge Edition Leads Ultra-Slim Hardware Innovation

Samsung Electronics has officially launched the Galaxy S25 series of smartphones worldwide. The lineup includes the Galaxy S25, S25+, and a new Galaxy S25 Edge model. The Galaxy S25 Edge is positioned as an “engineering marvel,” with its core highlight being new slim hardware innovation, signifying a major breakthrough in Samsung's flagship phone form factor design. Beyond hardware design, the series has garnered attention for its application scenarios and sustainability efforts. The press release notes that the Galaxy S25+ is being used to power the new audio tour at the Van Gogh Museum in the Netherlands, demonstrating its potential in cultural technology applications. Additionally, the Galaxy S25 has received the “2025 ReMA Design for Recycling®” award, highlighting Samsung's efforts in product recyclable design. <b>Comment</b>: The brief indicates that Samsung is pursuing multi-dimensional product differentiation with the Galaxy S25 series. In hardware, the launch of the ultra-slim Edge model aims to set a new design benchmark. In application, partnerships with cultural institutions like museums reinforce a premium, cultural brand attribute. Furthermore, winning an environmental award helps enhance the brand's ESG image. For companies focusing on consumer electronics innovation, Samsung's continued investment in “form factor innovation” and “scenario binding” for its flagship models is noteworthy.

Samsung Electronics Other Medium Signal 2026-03-03

Samsung Demonstrates Integrated AI and Mobile Tech for Large-Scale Events

Samsung integrated Galaxy AI translation with dedicated hardware at the Olympics, providing end-to-end cross-language communication solutions. The combination of on-device AI processing, specialized hardware deployment, and offline services created a complete technical service loop for large international events.

AMD Other Medium Signal 2026-03-03

AMD Expands Ryzen AI 400 Series Portfolio

AMD expands its Ryzen AI 400 series processor lineup with new models featuring integrated NPUs across premium to mainstream segments. The expansion enhances local AI workload processing for content creation and productivity applications.

Trend Micro Other High Signal 2026-03-03

Trend Micro Report Highlights AI Supply Chain Risks and Model Attack Surfaces

Trend Micro's 'Fault Lines in the AI Ecosystem' report systematically analyzes security risks in the AI supply chain, including training data poisoning, third-party plugin vulnerabilities, and model theft attacks. It indicates that enterprise AI security boundaries have expanded from traditional IT infrastructure to the model layer and data pipelines.

Cloudflare Other High Signal 2026-03-03

Cloudflare Threat Report Reveals Attack Shift from Breach to Identity Infiltration

Cloudflare's 2026 Threat Intelligence Report highlights a fundamental shift: attackers are moving from 'breaking in' to 'logging in', leveraging AI, supply chain compromises, and identity fraud. This necessitates a security focus shift from perimeter defense to internal identity verification and real-time threat intelligence.

Samsung Electronics Other Medium Signal 2026-03-03

Samsung Wins Rakuten Mobile Japan Nationwide Open RAN 5G Equipment Order

Samsung Electronics will provide O-RAN compliant 5G radio equipment to Rakuten Mobile Japan, including 700MHz low-band, 1.7GHz mid-band, and 3.8GHz massive MIMO solutions. The equipment will integrate into Rakuten's fully virtualized cloud-native Open RAN network for nationwide 5G deployment.

Samsung Electronics Other Medium Signal 2026-03-03

Samsung Demonstrates Galaxy AI Ecosystem Expansion from Devices to Infrastructure

Samsung showcased its Galaxy AI ecosystem at MWC 2026, spanning smartphones, XR headsets, foldable displays and underlying infrastructure services. Knox Enhanced Encrypted Protection offers application-level data isolation while Connected Care builds a digital health ecosystem.

Samsung Electronics Other Medium Signal 2026-03-03

Samsung and Vodafone Validate vRAN Solution on Intel Xeon 6 SoC

Samsung and Vodafone successfully tested a vRAN solution on Intel Xeon 6 SoC, supporting multi-generation networks and AI applications. The software-driven, cloud-native architecture enhances performance and reduces costs, with commercial deployment planned for 2026.