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MediaTek Other 2026-07-07

MediaTek and Alibaba Cloud Deploy Tongyi Qianwen LLM on Dimensity Chips

MediaTek partners with Alibaba Cloud to deploy a small version of the Tongyi Qianwen LLM on Dimensity 9300/8300 mobile platforms, enabling offline multi-turn conversations. This move aims to capture edge AI inference control via NPU optimization and SDK integration, directly challenging Qualcomm.

Qualcomm Other 2026-07-04

高通股价周四大涨15%,AI momentum交易推动投资者追捧

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Qualcomm Other 2026-07-02

Qualcomm Enters AI Inference with Dragonfly C1000 CPU and HBC Near-Memory Compute

Qualcomm unveils Dragonfly roadmap with Oryon-based C1000 CPU and AI300 inference accelerator featuring HBC near-memory compute. Meta and Microsoft are early adopters. The strategy targets AI inference TCO reduction and memory wall breakthrough, bypassing Nvidia's training dominance.

Samsung Electronics Other 2026-06-29

Samsung and SK Hynix Announce $300B Investment to Dominate AI Memory and Foundry

Samsung and SK Hynix announce a 10-year, 1,000 trillion won investment plan to expand HBM4 production, improve 3nm GAA yield, and build new AI chip fabs. This aims to cement their HBM duopoly and close the gap with TSMC in advanced foundry, reshaping global AI infrastructure supply chain costs.

Qualcomm Other 2026-06-25

Qualcomm Enters AI Datacenter with Dragonfly ARM CPU, Meta Signs Multi-Generation Deal

Qualcomm unveils Dragonfly C1000 ARM-based datacenter CPU, AI300 accelerator, and interconnect. Meta commits to multi-generation CPU supply, Microsoft Azure to deploy HBC chips. Qualcomm targets $15B+ datacenter revenue by FY2029, acquires Modular for software stack.

Google Other 2026-06-19

Google and XREAL Launch Android XR Smart Glasses: AI Platform Control Shift Intensifies

Google and XREAL launch Project Aura, the first XR glasses running Android XR, Qualcomm's Reality Elite chip, and Gemini AI. This move aims to capture OS control in spatial computing via an open platform and AI integration, challenging Apple and Meta's closed ecosystems.

Qualcomm Other 2026-06-18

Qualcomm Snapdragon Reality Elite: 160% NPU Boost, On-Device AI Redefines XR Chips

At AWE 2026, Qualcomm unveiled Snapdragon Reality Elite, its flagship XR chip with 60% GPU uplift and 160% NPU boost to 48 TOPS, enabling on-device LLM/VLM inference. The EVA vision engine reduces video pass-through latency by 10% and power by 33%. First device Xreal Aura runs Android XR, marking a new naming strategy and premium positioning.

Qualcomm Other 2026-06-16

Qualcomm's $8B Tenstorrent Bet: A RISC-V Chiplet Lock-in Play

Qualcomm is in talks to acquire AI chip startup Tenstorrent for $8-10 billion, targeting its RISC-V-based AI accelerators and chiplet technology. This move aims to reduce Arm dependency and bolster data center AI inference capabilities, marking a strategic pivot from mobile to infrastructure.

Qualcomm Other 2026-06-14

Qualcomm AI200 on AWS: Inference Chip Ecosystem Shifts from Nvidia Singularity to Multi-Alliance

Qualcomm's AI200 inference chip (768GB memory) is slated for broad AWS deployment by 2026, aiming to reduce cloud AI inference costs. This marks Qualcomm's strategic pivot from mobile to cloud, leveraging AWS's custom silicon initiative to challenge Nvidia's inference monopoly and restructure the cloud inference chip ecosystem.

AMD Other 2026-06-01

Qualcomm Unveils Dragonfly Data Center Brand, ARM-Based Compute Targets Enterprise AI Inference

Qualcomm announces Dragonfly, its new data center brand at Computex 2026, signaling a strategic expansion from mobile to enterprise compute. Leveraging ARM architecture, the brand targets low-power AI inference and edge computing. Specific product details will be revealed at an investor day in late June. The company also introduces Snapdragon C, an entry-level platform competing with Apple's MacBook Neo.

Google Other Medium Signal 2026-03-25

Google Open Sources AAOS SDV Platform for Automotive Software Architecture

Google open-sources its Android Automotive OS software-defined vehicle platform, providing open infrastructure for non-safety vehicle functions. This addresses automotive software fragmentation, enabling automakers to focus on differentiation rather than底层 development.

AMD Other High Signal 2026-03-19

AMD Defines Agent Computer Vision for Edge AI Architecture

AMD releases 2026 AI PC roadmap, proposing Agent Computer concept with expanded Ryzen AI stack featuring NPU-GPU-CPU heterogeneous architecture. Enables local multimodal AI agents, shifting PC from productivity tool to proactive AI partner.

Qualcomm Other High Signal 2026-03-13

Qualcomm and Ericsson Complete World's First 6G System-Level Prototype Validation

Qualcomm and Ericsson have completed the world's first commercialization-oriented 6G system-level prototype validation, achieving 1.2 Gbps downlink peak rate and sub-1ms end-to-end latency in the 6GHz band. Conducted at Ericsson's lab, this validation confirms 6G key technology feasibility and sets the foundation for standardization.

Qualcomm Other High Signal 2026-03-13

Qualcomm Launches AI-Native Wi-Fi 8 Portfolio with Dedicated AI Accelerators

Qualcomm launches AI-native Wi-Fi 8 portfolio including FastConnect 8200 client chip and Networking Pro 1630 networking platform. Both integrate dedicated AI accelerators, support MLO multi-link operation and 320MHz channel bandwidth, enabling real-time network optimization and low-power AI processing. This signifies wireless connectivity evolution from general transmission to AI-driven感知 network architecture.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm and Industry Leaders Commit to 6G Commercial Roadmap Targeting 2029 Launch

Qualcomm and key industry players jointly committed to a 6G commercialization roadmap with 2029 as the target launch date. This commitment aims to coordinate global R&D and standardization efforts for next-generation wireless networks.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm Releases R19-Ready X105 Modem for 6G Evolution

Qualcomm launches the world's first 3GPP Release 19-compliant 5G-Advanced modem X105, supporting smartphones, XR devices and industrial IoT. The product provides foundational connectivity for 6G evolution and strengthens Qualcomm's leadership in baseband chips.

Qualcomm Other High Signal 2026-03-13

Qualcomm and Siemens Demo Industrial AI Edge Computing with 5G Private Network Integration

Qualcomm demonstrated a digital twin solution with Siemens at MWC, integrating Qualcomm Aware Platform and AI Stack for on-premises AI inference combined with 5G private network for reliable connectivity. The solution deploys edge AI and connectivity directly at industrial sites for predictive maintenance and real-time digital twins.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm and T-Mobile Deepen Collaboration to Accelerate 5G Advanced to 6G Transition

Qualcomm and T-Mobile announced an enhanced strategic collaboration focusing on AI-driven network optimization, Open RAN deployment, and 6G foundational R&D. The partnership combines chip, wireless technology, and network infrastructure strengths to improve performance and intelligence, advancing mobile ecosystem progress.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm Launches Wearable Platform with Dedicated AI Engine

Qualcomm introduces Snapdragon Wear Elite platform with dedicated AI engine to enhance performance and energy efficiency for wearables. The platform is optimized for smartwatches and health trackers, enabling more complex AI applications.

Qualcomm Other Medium Signal 2026-03-13

Arduino Integrates Qualcomm Dragonwing Chips for Edge AI Development Platform

Arduino launches VENTUNO Q board with Qualcomm Dragonwing IQ8 series processors, designed for IoT and edge AI applications. The platform integrates power-efficient AI acceleration capabilities for enhanced edge computing.