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Anthropic Other 2026-07-05

Anthropic Launches Custom AI Chip: Vertical Integration to Control Inference Cost and Supply

Anthropic launched Claude Sonnet 5 and revealed a custom AI chip initiative, using Samsung foundry. This move aims to reduce dependency on NVIDIA, control long-term inference costs, and marks Anthropic's shift from a pure software company to a vertically integrated infrastructure firm.

NVIDIA Other 2026-07-04

NVIDIA Vera Rubin AI Platform Slated for July 2026 Shipments, Iterative Compute Upgrade

NVIDIA confirms its next-gen AI compute platform, Vera Rubin, will start shipping in July 2026 to major cloud providers like Microsoft and Google. The platform uses an advanced process node to boost AI training and inference performance, representing an iterative upgrade over Hopper and Blackwell without a fundamental architectural shift.

NVIDIA Other 2026-07-04

英伟达RTX 5080公版显卡将在BW2026限量发售,售价8299元

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Meta Other 2026-07-04

Meta Shifts MTIA ASIC to Samsung 2nm: Ecosystem Restructuring in AI Chip Fab

Meta partners with Samsung for next-gen MTIA ASIC production, moving from TSMC to Samsung 2nm node. Targeting hundreds of thousands of units to support 5GW data center goal by 2030, with new chip every six months, restructuring the AI chip supply chain ecosystem.

Anthropic Other 2026-07-04

Anthropic in talks with Samsung for 2nm AI chip, targeting NVIDIA CUDA control shift

Anthropic is in early talks with Samsung to manufacture custom AI chips using 2nm process and advanced packaging, hiring ex-OpenAI chip engineer Clive Chan. This aims to reduce NVIDIA GPU dependency and seize control of AI infrastructure, signaling a control plane shift in AI compute.

Qualcomm Other 2026-07-04

高通股价周四大涨15%,AI momentum交易推动投资者追捧

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AMD Other 2026-07-04

AMD通知AIB合作伙伴上调GPU核心与GDDR捆绑套料出货价约10%

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Meta Other 2026-07-03

Meta Admits AI Agent Stagnation, Plans to Sell Compute to Challenge Cloud Triopoly

Meta CEO Zuckerberg admits AI agent development is behind schedule, pushing ROI timeline to 3-6 months. Concurrently, Meta plans to sell AI compute and model access externally, directly challenging AWS, Azure, and GCP's cloud oligopoly, signaling a pivot from internal AI infrastructure to a commercial cloud provider.

OpenAI Other 2026-07-03

OpenAI Slashes Inference Costs 50%, Runs ChatGPT on Hundreds of GPUs via System-Level Optimization

OpenAI reduces AI inference costs by over 50% through system-level optimizations: model quantization (FP16 to INT4/INT8), KV-Cache optimization, dynamic batching, and speculative decoding. Using only hundreds of NVIDIA GPUs to serve ChatGPT's unlogged-in traffic, inference gross margin jumps from 38% to 65%, nearing breakeven.

NVIDIA Other 2026-07-02

NVIDIA AI Compute Partnership: Revenue Share and Credit Backstop to Lock Cloud Providers into DSX AI Factories

NVIDIA launches AI Compute Partnership with revenue sharing and credit backstop, shifting from hardware sales to recurring service revenue. Initial projects include 40K GB300 chips for Sharon AI and 170K GPUs for Firmus, totaling 200K+ high-end chips. NVIDIA is becoming the 'central bank' of AI compute, squeezing cloud brokers.

Apple Other 2026-07-02

传苹果与两家国内芯片厂商展开谈判

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Qualcomm Other 2026-07-02

Qualcomm Enters AI Inference with Dragonfly C1000 CPU and HBC Near-Memory Compute

Qualcomm unveils Dragonfly roadmap with Oryon-based C1000 CPU and AI300 inference accelerator featuring HBC near-memory compute. Meta and Microsoft are early adopters. The strategy targets AI inference TCO reduction and memory wall breakthrough, bypassing Nvidia's training dominance.

Samsung Electronics Other 2026-07-01

Samsung Restarts 1.4nm Foundry Node, Pre-emptively Locks Equipment Supply Chain

Samsung Electronics restarts 1.4nm (SF1.4) process commercialization, ordering equipment vendors to develop tools early. The node will use High-NA EUV lithography and GAA transistors, fabbed at NRD-K campus. This move aims to catch up with TSMC and Intel, but mass production timeline remains undisclosed.

TSMC Other 2026-07-01

Etched Unveils Sohu Transformer ASIC: Claims 20x H100 Inference Throughput, Challenging NVIDIA's Grip

AI chip startup Etched emerges from stealth with Sohu, a Transformer-specific ASIC on TSMC N4P with 144GB HBM3E. By hardwiring attention mechanisms, it claims 20x throughput and 140x price-performance vs. H100 on Llama 70B. With $800M total funding and first racks shipping this summer, it directly challenges NVIDIA's inference dominance.

AMD Other 2026-06-30

AMD and NVIDIA Raise GPU Kit Prices by 10%: GDDR Shortage Exposes AI Supply Squeeze

AMD has notified AIB partners of a ~10% price hike on GPU+GDDR bundled kits effective July 2026, following NVIDIA's similar move on RTX 5090 series. The dual price increases stem from severe GDDR supply shortages driven by the AI boom and memory super-cycle, foreshadowing broad retail GPU price increases in H2.

Amazon Other 2026-06-30

AWS and Google Open Custom AI Chips for External Sales, ASIC Shipment Growth Surpasses GPU, TCO Inflection Point Reached

In Q2 2026, AWS Trainium and Google TPU are commercialized externally for the first time. Custom ASIC shipment growth of 44.6% surpasses GPU's 16.1%. ASIC TCO advantage reaches 40-65% for large-scale inference; Midjourney cut monthly compute cost from $2.1M to $0.7M after migrating to TPU. This marks a structural inflection point in AI compute.

OpenAI Other 2026-06-30

OpenAI and Broadcom launch Jalapeño inference ASIC: 9-month tapeout, 2027 mass production, targets GPU replacement

OpenAI and Broadcom unveil Jalapeño, a custom inference ASIC designed in 9 months using OpenAI's own LLMs. Early benchmarks show superior performance-per-watt vs. current GPUs. Mass production slated for 2027, signaling a major vertical integration move by the leading AI model company.

Samsung Electronics Other 2026-06-30

Samsung Re-accelerates 1.4nm Node R&D, Adopts High-NA EUV Lithography

Samsung Electronics is re-accelerating its 1.4nm (SF1.4) process node R&D, targeting mass production by 2028-2029. It has procured High-NA EUV lithography equipment from ASML for its NRD-K R&D complex and ordered tools for 12th-gen V-NAND with wafer stacking. The move aims to catch up with TSMC and Intel in the AI chip foundry race.

TSMC Other 2026-06-30

TSMC, ASML, imec Demonstrate 300mm 2D Material CMOS with 50nm CPP, 94% Yield

TSMC, ASML, and imec jointly demonstrated the first 300mm wafer-scale integration of 2D material transistors at VLSI 2026, achieving 50nm contacted poly pitch (CPP) for MoS₂ nFET and WS₂/WSe₂ pFET with 28nm channel length and 94% yield, marking a critical step toward industrializing 2D semiconductors.

Google Other 2026-06-29

Google Caps Meta's Gemini Access: AI Compute Bottleneck Reshapes Cloud Ecosystem

Google restricts Meta's access to Gemini API due to compute capacity shortage, delaying Meta's AI projects. This reveals that even with custom TPUs and massive data centers, Google cannot meet surging demand, forcing the industry to reassess AI compute allocation and supply chain resilience.