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OpenAI Other 2026-06-08

OpenAI Pivots to Codex: From Chatbot to Agentic Control Plane for Enterprise Automation

OpenAI plans its biggest ChatGPT overhaul, integrating Codex, AI agents, and third-party apps into a super-app. This marks a strategic pivot from a Q&A chatbot to an agentic execution platform, with Codex as the new control plane, aiming to boost enterprise monetization and counter Anthropic's competitive threat.

Intel Other 2026-06-02

Intel and SambaNova Launch Rack-Scale AI, CPU Reclaims Inference Control

At Computex 2026, Intel unveiled a rack-scale AI infrastructure combining Xeon 6+ processors with SambaNova SN-50 RDU, and a decoupled inference cloud (Vector Core Compute) using Xeon 6+ for orchestration, Blackwell GPU for prefill, and SN40 RDU for decode. This CPU-centric approach targets agentic AI inference, challenging NVIDIA's GPU dominance.

NVIDIA Product Launch 2026-05-29

NVIDIA's Triple Play: Vera CPU, N1X Laptop Chip, and $6.5B Silicon Photonics Reshape AI Infra Control

NVIDIA delivers first agent-specific Vera CPU (88 Arm v9.2 cores, 1.2TB/s memory bandwidth), teases consumer N1X laptop chip, and invests $6.5B in silicon photonics. This shifts AI orchestration control from x86 to NVIDIA's Arm ecosystem, while CPO addresses memory wall, but volume production remains challenging until post-2028.

Apple Partnership High Signal 2026-04-27

Apple-Google Multi-Year Partnership Confirmed: Gemini to Power New Siri

Apple and Google confirm multi-year partnership with Google Cloud as preferred provider. Google is building a custom 1.2 trillion parameter Gemini model for Apple, 8x Apple's current cloud model. Siri will gain Gemini capabilities in 2026 with iOS 27. Privacy architecture unchanged—Gemini runs on Apple-controlled servers with data protection guarantees. Device compatibility limits exclude hundreds of millions of older iPhone users.

Nokia Other Medium Signal 2026-04-10

Nokia Opens R&D and Manufacturing Campus in Oulu Focused on AI-Driven Networks

Nokia has opened a new R&D and manufacturing campus in Oulu, Finland, dedicated to designing, testing, and delivering next-generation networks built for AI. The campus integrates R&D, smart manufacturing, and a partner ecosystem, aiming to advance 5G/6G and private networks to power the AI supercycle with essential connectivity.

Ericsson Other Medium Signal 2026-03-25

Ericsson Collaborates on 6G AI Network Sensing and Optimization

Ericsson partners with Forschungszentrum Jülich to develop 6G AI technologies, focusing on neuromorphic and quantum computing for network sensing and optimization. The collaboration addresses 6G network complexity, energy efficiency, and real-time data processing challenges through non-von Neumann computing paradigms.

Ericsson Other Medium Signal 2026-03-23

Ericsson and SK Telecom Partner on AI-RAN and 6G Network Innovation

Ericsson and SK Telecom signed an MoU to jointly develop AI-RAN, network slicing, and cloud-native architectures. They will establish a joint innovation center in Korea to explore AI-driven network optimization and automation. The collaboration aims to build foundational technologies for 6G networks.

Ericsson Other Medium Signal 2026-03-19

Ericsson and SK Telecom Deepen AI-RAN and 6G Network Innovation Collaboration

Ericsson and SK Telecom signed an MOU to jointly develop AI-driven network automation and energy-saving technologies, focusing on deep integration of AI into radio access networks. The collaboration covers network evolution from 5G to 6G, aiming to enhance network performance and efficiency.

NVIDIA Other High Signal 2026-03-17

NVIDIA Partners with Industrial Software Giants to Advance AI in Manufacturing

NVIDIA collaborates with industrial software leaders like Siemens and Ansys to integrate AI into design and manufacturing. Leveraging Omniverse platform and generative AI to accelerate digital-to-physical workflows. Focuses on digital twins and generative AI for product development optimization.

NVIDIA Other High Signal 2026-03-17

NVIDIA Releases Open Physical AI Data Factory Blueprint

NVIDIA introduces an open physical AI data factory blueprint, offering a standardized data generation and synthesis framework to accelerate training and development for physical AI applications like robotics, vision AI, and autonomous vehicles. The blueprint addresses large-scale real-world data acquisition challenges through reference architecture, lowering industry barriers and boosting R&D iteration.

NVIDIA Other High Signal 2026-03-17

NVIDIA Launches Open Agent Development Platform for Physical AI Applications

NVIDIA launches an open agent development platform to transition AI agents from virtual to physical operations. The platform lowers barriers for developing autonomous systems for complex tasks, supporting automation in manufacturing and logistics.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm and Industry Leaders Commit to 6G Commercial Roadmap Targeting 2029 Launch

Qualcomm and key industry players jointly committed to a 6G commercialization roadmap with 2029 as the target launch date. This commitment aims to coordinate global R&D and standardization efforts for next-generation wireless networks.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm and T-Mobile Deepen Collaboration to Accelerate 5G Advanced to 6G Transition

Qualcomm and T-Mobile announced an enhanced strategic collaboration focusing on AI-driven network optimization, Open RAN deployment, and 6G foundational R&D. The partnership combines chip, wireless technology, and network infrastructure strengths to improve performance and intelligence, advancing mobile ecosystem progress.

Qualcomm Other Medium Signal 2026-03-13

Qualcomm and Wayve Partner to Advance End-to-End AI Driving Model for Mass Production

Qualcomm partners with Wayve to integrate its end-to-end AI driving model LINGO-2 into the Snapdragon Ride platform, aiming to merge perception, decision-making and planning into a single neural network. The collaboration focuses on meeting automotive industry requirements for performance, safety and cost, advancing end-to-end AI architecture from R&D to mass production.

NVIDIA Other Medium Signal 2026-03-12

NVIDIA and Dassault Systèmes Integrate Virtual Twin and AI Physics Models

NVIDIA partners with Dassault Systèmes to integrate virtual twin platforms with NVIDIA accelerated computing, AI physics models, and CUDA-X/Omniverse libraries. The integration enables AI-based physical behavior simulation through SIMULIA software for real-time prediction across industries.

Ericsson Other Medium Signal 2026-03-09

Ericsson Deepens 5G Advanced and AI-Native Network Collaboration with FarEasTone

Ericsson signs a three-year strategic agreement with FarEasTone to advance 5G Advanced deployment and AI-native network R&D. The collaboration includes key technologies like network slicing, URLLC, and RedCap, enabling Industrial 4.0 and smart city applications. Both parties will jointly research 6G and AI-driven network automation.

TSMC Other High Signal 2026-03-08

TSMC Discloses 2nm and Beyond Technology Roadmap

TSMC announces its 2nm (N2) process will adopt GAAFET architecture replacing FinFET, with plans for subsequent A-series nodes. The technology targets performance and efficiency gains for HPC and mobile applications, leveraging new materials and 3D packaging for AI and 5G/6G demands.

TSMC Other High Signal 2026-03-07

TSMC Releases Advanced Process Roadmap, N2 and A16 Technologies Lead Chip Innovation

TSMC unveiled its logic process technology roadmap, highlighting advanced nodes like N2 and A16. N2 adopts GAAFET architecture for performance and power efficiency gains, while A16 integrates backside power delivery for HPC optimization, reinforcing TSMC's leadership in semiconductor manufacturing.

Huawei Other High Signal 2026-03-04

Huawei Launches AI Data Platform with Compute-Storage Separation

Huawei launched an AI data platform featuring compute-storage separation architecture for efficient data flow. It integrates high-performance file system supporting EB-level data and accelerates AI training data preparation by 30%. Provides unified data management with seamless integration to major AI frameworks and Ascend hardware.

Samsung Electronics Other 2026-03-02

Samsung Develops Tri-Fold Device Exploring New Form Factor

Samsung is developing Galaxy Z TriFold with triple-fold design, featuring advanced hinge and screen technology to expand display size or enable more compact form. This represents Samsung's continued investment in foldable technology frontier.