Reports
AI-generated structured vendor updates
TSMC
Other
2026-06-17
TSMC Accelerates Glass Substrate CoWoS with Japanese and Taiwan Partners
TSMC partners with Ibiden and Innolux to develop glass substrates for next-gen CoWoS packaging. Simulation shows 16% warpage improvement, 27% resistance reduction, targeting AI chip performance and reliability amid competition from Intel and Samsung.
TSMC
Other
2026-06-17
台积电首次公开CoWoS玻璃基板开发计划
...
TSMC
Other
2026-06-16
TSMC Discloses Glass Substrate Pilot, Packaging Paradigm Shifts
TSMC, with Ibiden and Innolux, publicly discloses glass substrate integration into CoWoS for advanced packaging. Glass offers superior electrical and thermal properties over organic substrates, enabling larger dies and higher density. Mass production is distant; CoPoS remains near-term priority.