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AMD Other Medium Signal 2026-03-07

AMD Promotes EPYC Processor Security Solutions for Retail/E-commerce

AMD highlights EPYC processors with built-in Infinity Guard security suite and energy efficiency for retail/e-commerce solutions. Supports seamless integration with existing x86 infrastructure, offering multi-generation product coverage for diverse computing needs.

Huawei Other Medium Signal 2026-03-06

Huawei Jointly Releases Large-Temperature-Difference Cooling Whitepaper for Data Center Energy Efficiency

Huawei jointly released a whitepaper on large-temperature-difference cooling systems, detailing how increased water temperature differential reduces flow and pump energy consumption. Combined with efficient chillers and indirect evaporative cooling, it effectively lowers data center PUE.

Huawei Other Medium Signal 2026-03-06

Huawei Launches Data Center Resilience Service Solution 1.0

Huawei partners with Arrow ECS France to launch a data center resilience service solution offering end-to-end assessment and design services covering infrastructure, network, storage and cloud platforms. The solution focuses on building high-availability active-active/active-passive architectures with standardized operational processes.

Google Other Medium Signal 2026-03-05

Google Introduces Data Center Energy Commitment Framework for AI Power Demand

Google signs White House energy commitment, establishing a capacity commitment framework to ensure data centers bear 100% of new power costs. Pledges investments in advanced nuclear and geothermal energy while driving grid modernization. Sets 1.09 PUE efficiency standard significantly exceeding industry average.

Huawei Other Medium Signal 2026-03-05

Huawei Releases AI-Native Data Center Networking Solution Galaxy AI Fabric 2.0

Huawei launched Galaxy AI Fabric 2.0 data center networking solution with AI-Native architecture for autonomous networking. It includes self-developed Solar 5.0 chip switches, iLossless 3.0 algorithm, and intelligent management platform, supporting 10,000-card AI clusters.

TSMC Other High Signal 2026-03-05

TSMC Advances AI Hardware Innovation with Advanced Process and 3D Packaging

TSMC reveals AI technology research progress, focusing on N3/N2 advanced nodes and 3D Fabric heterogeneous integration. It enhances AI chip performance and efficiency through optimized transistor architecture and packaging, targeting memory bandwidth bottlenecks for cloud-to-edge AI applications.

AMD Other Medium Signal 2026-03-04

AMD Launches Power Design Manager for Hardware Design Optimization

AMD introduces Power Design Manager, a tool for power modeling, analysis, and optimization in hardware design. It integrates with AMD's FPGA and adaptive SoC platforms, enabling engineers to identify power hotspots early and optimize energy efficiency.

AMD Other Medium Signal 2026-03-04

AMD Releases Updated Device Models for FPGA and Adaptive SoC Verification Acceleration

AMD released updated device models for core product lines including Versal ACAP and UltraScale+, enhancing pre-silicon simulation accuracy and toolchain compatibility. The update aims to accelerate hardware design verification and reduce development risks for complex systems like AI and data centers.

AMD Other Medium Signal 2026-03-04

AMD Launches Vitis Unified Platform for AI and HPC Development

AMD launches Vitis unified software platform, simplifying FPGA and adaptive SoC development through high-level programming models. The platform integrates optimized libraries for AI inference and data analytics, supports mainstream AI frameworks, and provides performance analysis tools. This lowers the barrier for heterogeneous computing development.

AMD Other Medium Signal 2026-03-04

AMD Enhances Vivado and Vitis Integration for Hardware-Software Co-Design

AMD's Vivado design suite deepens integration with Vitis unified software platform, offering full development from high-level synthesis to system integration. It enhances IP-based design reuse and supports hardware-software co-design for FPGA, adaptive SoC, and ACAP.

NVIDIA Other High Signal 2026-03-03

NVIDIA Partners with Coherent on Data Center Optical Interconnect Tech

NVIDIA partners with photonics specialist Coherent to develop next-gen data center optical interconnect technology. The collaboration targets high-performance, high-density, low-power optical solutions for AI and HPC workloads, addressing bandwidth and efficiency bottlenecks. This strengthens NVIDIA's system-level optimization in AI infrastructure hardware ecosystems.

AMD Other Medium Signal 2026-03-03

AMD to Unveil End-to-End AI Strategy and Product Roadmap

AMD announces Advancing AI event to articulate its AI vision and update end-to-end product portfolio. The event likely covers AI accelerators and software ecosystem from data center to edge, demonstrating its strategy to strengthen full-stack AI capabilities.

NVIDIA Other High Signal 2026-03-02

NVIDIA and Coherent Collaborate on Data Center Optical Interconnect Technology

NVIDIA and optical technology provider Coherent have formed a strategic partnership to develop next-generation data center optical interconnect solutions. The collaboration combines NVIDIA's AI computing expertise with Coherent's photonics technology to deliver higher bandwidth and lower latency interconnects for AI clusters and HPC.

Amazon Other High Signal 2026-03-02

AT&T Integrates Fiber Network with AWS Cloud AI Infrastructure

AT&T migrates local workloads to AWS Outposts hybrid cloud and uses its fiber network to connect AWS data centers for enhanced AI application support. Expands coverage via Amazon LEO satellites for end-to-end connectivity infrastructure.

Amazon Other Medium Signal 2026-03-02

AWS Healthcare Customer Completes Full Migration to Cloud for AI-Ready Data Architecture

WellSpan Health is migrating its entire technology infrastructure from on-premises data centers to AWS, including 7.5 PB of data and over 300 applications. The migration aims to build a unified, AI-ready data foundation through AWS's secure and compliant architecture, addressing healthcare data silos. Post-migration, medical AI application efficiency is expected to significantly improve, reducing task processing times from days to minutes.

NVIDIA Other High Signal 2026-03-01

NVIDIA Releases Agentic AI Blueprint and Inference Models for Telecom

NVIDIA introduces Agentic AI blueprint and specialized inference models for telecom, built on NeMo framework to autonomously handle network operations. The solution lowers deployment barriers through pre-trained models, advancing telecom networks toward autonomous architecture.

AMD Other Medium Signal 2026-03-01

AMD Launches Vivado ML Edition, Integrating AI Optimization into Hardware Design Toolchain

AMD launches Vivado ML edition, introducing machine learning-based automation for FPGA and adaptive SoC design. The tool enhances chip performance, power, and area efficiency through intelligent algorithms, while improving team collaboration and dynamic hardware reconfiguration capabilities.

AMD Other Medium Signal 2026-03-01

AMD Launches Design Hubs to Strengthen Adaptive Computing Development Ecosystem

AMD launches Design Hubs platform integrating documentation, reference designs, IP cores and tools to provide one-stop development support for Versal adaptive SoCs and FPGAs. The platform reduces technical barriers through structured development paths, accelerating hardware acceleration applications in data centers and networking.

AMD Other Medium Signal 2026-03-01

AMD Strengthens Data Center Accelerator Product Line

AMD's AECG division launches data center accelerator product lines utilizing GPU and Versal adaptive computing technologies for AI/HPC workloads. This move strengthens AMD's competitive position in the data center accelerator market against NVIDIA. The product portfolio offers enterprises alternative AI/HPC hardware solutions.

Microsoft Other Medium Signal 2026-03-01

Microsoft Integrates Data Center Sustainability Strategy with AI Business Expansion

Microsoft integrates sustainability goals into data center design, operations, and expansion to support cloud and AI growth. Plans 40% cloud capacity increase in Europe by 2027, operating 200+ data centers by 2026, using tech innovations for AI workloads.