Reports
AI-generated structured vendor updates
苹果M7芯片跳过M6代际直指端侧AI推理加速
...
高通通知客户9月1日后骁龙芯片涨价两位数
...
NVIDIA Vera Rubin NVL72 Enters Production, 10x Energy Efficiency Reshapes AI Infrastructure
NVIDIA has announced full production of the Vera Rubin NVL72 platform, with first shipments to CoreWeave, Microsoft, Amazon, and Oracle. Each rack integrates 72 Rubin GPUs and 36 Vera CPUs, delivering 10x improvement in energy efficiency and inference cost over Blackwell for agentic AI workloads, marking a new era of rack-scale AI infrastructure.
ASML Q2营收93亿欧元 High-NA EUV在Intel 18A达到生产级良率
...
AMD发布第六代EPYC Venice处理器与Helios机架级AI解决方案
...
AMD Helios Enters Production: 12-Stack HBM4 Outmuscles NVIDIA, UALoE Opens AI Network
AMD's second-generation Helios rack-scale AI server enters full production, featuring 72 MI455X GPUs with Samsung's exclusive 12-stack HBM4 (31TB per rack). Compared to NVIDIA's 8-stack design, it offers 50% more memory and 30% lower token cost. Microsoft Azure commits to large-scale deployment, solidifying hyperscaler dual-vendor strategy.
Intel Accelerates 14A to 2027H2 Risk Production, 18A Yield Exceeds Target by 25%, Capex Raised to $20B
Intel announced 14A process acceleration to risk production in 2027H2 with HVM in 2028, 18A yield exceeding target by 25% supporting Panther Lake volume, and raising 2026 capex to $20B, signaling an aggressive foundry push. Advanced packaging EMIB-T becomes a profit pillar.
AMD Helios Rack Challenges NVIDIA NVLink with Open UALoE Interconnect
At Advancing AI 2026, AMD launched the Helios rack with 72 MI455X GPUs, 18 Venice EPYC CPUs, and Pensando networking, claiming 30% higher inference token/$ vs NVIDIA NVL72. It introduced UALoE open interconnect to break NVLink lock-in, partnering with Cerebras, Cisco, and major AI firms.
Microsoft Azure Deploys AMD Helios Rack with MI455X GPUs, Launches Three New VM Families
Microsoft Azure announces the deployment of AMD Helios rack-scale AI platform, featuring 72 Instinct MI455X GPUs, 31TB HBM4 memory, and 1.4PB/s bandwidth per rack. Three new VM families target AI inference, data engineering, and HPC, powered by 6th-gen EPYC Venice CPUs and Pensando DPUs.
NVIDIA-OpenAI $100B Partnership: 10GW Vera Rubin AI Factories Reshape Ecosystem
NVIDIA and OpenAI announce a strategic partnership to deploy at least 10GW of NVIDIA systems using the Vera Rubin platform (Rubin GPU, Vera CPU, HBM4, NVLink 6). NVIDIA will invest up to $100B. First facilities go online in H2 2026, powering OpenAI's next-gen models, marking the era of multi-GW AI factories.
AMD Unveils Zen 6 Venice, MI455X, and Helios Rack-Level Design to Challenge NVIDIA
At Advancing AI 2026, AMD launched Zen 6 EPYC Venice (2nm, up to 256 cores) and MI455X (CDNA5, 432GB HBM4, 40 PFLOPS FP4), along with Helios rack reference design (2.9 exaFLOPS FP4 per rack), claiming a 1000x AI performance roadmap, with major commitments from Meta, OpenAI, and others.
FortiBleed攻击全球暴露约75000台Fortinet防火墙设备
...
Intel与Fortinet战略合作开发SP6安全处理器，18A工艺良率提升至85%
...
NVIDIA公开Rubin GPU架构细节：3360亿晶体管，智能体AI性能较Blackwell提升10倍
...
NVIDIA Reveals Vera Rubin GPU and Vera CPU: 3360B Transistors, 88-Core Olympus, 10x Agentic AI Efficiency
NVIDIA fully discloses Vera Rubin GPU and Vera CPU specifications. The GPU features 3360B transistors, HBM4 288GB, and 10x agentic AI efficiency over Blackwell. The CPU has 88 custom Olympus cores, delivering 2.2x faster agentic AI performance than Intel Sapphire Rapids. This solidifies NVIDIA's full-stack strategy against x86 incumbents.
Microsoft Azure Deploys AMD Helios Rack with MI455X GPUs, Breaking NVIDIA's Cloud AI Monopoly
Microsoft Azure officially adopts AMD Helios rack-scale AI infrastructure, featuring 72 MI455X GPUs (432GB HBM4, 19.6TB/s), Venice EPYC CPUs, and Pensando DPUs. Three new instances (ND MI455X v7, HDv2, HXv2) are launched, marking Azure's shift from exclusive NVIDIA dependency to a multi-vendor AI strategy.
IBM Unveils 0.7nm Nanostack 3D Transistor, Doubling Density and Extending Moore’s Law
IBM debuts the world’s first sub-1nm chip technology at 0.7nm node using a nanostack 3D transistor architecture, packing nearly 100 billion transistors with double the density of its 2nm node. It delivers 50% performance gain or 70% energy efficiency improvement, and 40% SRAM scaling for AI workloads.
Intel 18A Yield Hits 85%, Secures Orders from NVIDIA, OpenAI, Reshaping Foundry Landscape
Intel reports 18A process yield improvement to 85%, from 65% last quarter, nearing TSMC N2's 90%. Secured foundry deals with NVIDIA, AMD, OpenAI, etc. EMIB advanced packaging yield reaches 98%, used in NVIDIA Feynman, Google TPU. This marks a strategic inflection in AI chip manufacturing.
Intel Launches Starfire Space-Grade SoC on 18A to Challenge Xilinx Dominance
Intel unveils Starfire, a space-grade SoC built on Intel 18A process with Foveros packaging, derived from Panther Lake. Targeting satellite payloads and on-orbit AI inference, sampling in Q3 2026, it aims to disrupt Xilinx/Microchip's space FPGA ecosystem with advanced AI and SWaP-C optimization.
TSMC Hikes Sub-7nm Prices 8-12%, Extends Lead Times to 26 Weeks, Triggering AI Chip Cost Inflation
TSMC raises sub-7nm wafer prices by 8-12% and extends lead times to 26 weeks, effective July 2026. New v2.1 directive mandates EDA tool validation for PDK access. This directly inflates AI chip TCO, delays new product launches, and solidifies TSMC's control over the AI supply chain.